Difference between revisions of "CoE 197U"
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* High-Swing Current Sources | * High-Swing Current Sources | ||
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− | * | + | * Understand ideal and real sources |
− | * | + | * Analyze MOS simple current mirror |
− | * | + | * Analyze High-swing current sources |
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* Slides: Current Sources [https://drive.google.com/file/d/19jU1NupCk66ta6Q3tJyWFYDUagqaZCQs/view?usp=sharing PDF] | * Slides: Current Sources [https://drive.google.com/file/d/19jU1NupCk66ta6Q3tJyWFYDUagqaZCQs/view?usp=sharing PDF] | ||
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* Two-Stage MOS Operational Transconductance Amplifiers | * Two-Stage MOS Operational Transconductance Amplifiers | ||
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− | * | + | * Understand differential circuits |
− | * | + | * Analyze MOS differential pairs |
− | * | + | * Understand operational amplifier operation |
− | * | + | * Analyze Miller Operational Amplifiers |
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* Slides: MOS Differential Pairs [https://drive.google.com/file/d/10p4T9_5qMXiXPeVU0B0yHmzmtTabiQ43/view?usp=sharing PDF] | * Slides: MOS Differential Pairs [https://drive.google.com/file/d/10p4T9_5qMXiXPeVU0B0yHmzmtTabiQ43/view?usp=sharing PDF] |
Revision as of 02:30, 13 March 2021
- Introduction to Analog and Digital Integrated Circuit Design
- Semester Offered: 2nd semester
- Course Credit: Lecture: 3 units (2 units lecture, 1 unit lab)
Catalog Description
IC Fabrication. CMOS gates. Logical Effort. Interconnect. Memory Elements. MOS Amplifiers. Current Sources. Differential Amplifiers. Operational Transconductance Amplifiers. Pre-req: EEE 41 or EEE 131. 5h (2 lec, 3 lab) 3 u.
Syllabus
Module | Topics | Outcomes | Resources | Activities |
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Part I: Digital Integrated Circuits | ||||
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2 |
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3 |
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4 |
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5 |
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Part II: Analog Integrated Circuits | ||||
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7 |
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8 |
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9 |
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10 |
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References
- Rabaey, Chandrakasan, Nikolic, Digital Integrated Circuits, 2ed., Pearson 2002.
- Gray, Hurst, Lewis, Meyer, Analysis & Design of Analog Integrated Circuits, Wiley 2001.
- Johns, Martin, Analog Integrated Circuit Design, Wiley 1997.
- Design of Analog CMOS Integrated Circuits, Behzad Razavi, McGraw-Hill, 2000.
- R. Jacob Baker, Circuit Design, Layout,and Simulation, 4ed., IEEE Press 2019.